| 摘要 |
A MULTI-LAYER CERAMIC SUBSTRATE ASSEMBLY AND A PROCESS FOR MANUFACTURING SAME A multi-layer ceramic substrate assembly comprising a multi-layer ceramic substrate including a viaconductor and an interconnecting line and having a surface, a first soldering pad on the surface of the substrate and connected to the via-conductor, a second soldering pad on the surface of the substrate adjacent to the first soldering pad, a connecting pattern on the surface of the substrate for connecting the first and second soldering pads, the connecting pattern being made of an electric conductor wettable with a solder, and a solder dam formed on the connecting pattern between the first and second soldering pads, the solder dam being made of a metal or a metal alloy or compound not wettable with a solder. The electric conductivity of the connecting pattern is carried by a metal having a good electric conductivity and the solder dam is made of a metal or a metal alloy or compound not wettable with a solder, whereby the solder dam stops a flow of a solder through the dam or under the dam. A simple and reliable process for forming such a solder dam is also provided. |
