| 摘要 |
PURPOSE:To perform a solder connecting step with high precision without giving mechanical shock at all to the electrode on a substrate. CONSTITUTION:A solder piece 15 comprising a solder material 14 punched out by the end of a punch 1 using the punch 1 and a dice 3 is brought into contact with an LSI 7 previously coated with a flux 5 so that the solder piece 15 may be arranged on specific positions of the LSI 7 to be welded into an electrode 6 as a solder bump 8 to be flip-chip packaged on a substrate 9. |
