| 摘要 |
<p>PURPOSE:To manufacture an electronic component, in which a substrate is insert-molded in a resin case, without generation of cracks on the substrate even when the brittle material such as ceramic is used, and also without generation of undesirable resin burrs on the substrate. CONSTITUTION:A substrate 2 is held on the prescribed position in a mold 8 by a supporting member 10, an O-ring 6, consisting of elastic material, is interposed between the substrate 2 and the core pin 21 to be used to pinch the substrate 2 by pressing it to the supporting member 10, the substrate 2 is insert- molded by injecting resin into the mold 8, and after the core pin 21 has been removed, the rotating member such as a rotor and the like is provided in the space where the core pin 21 was removed.</p> |
