APPARATUS FOR MOUNTING OF INTEGRATED CIRCUIT CHIP

摘要

PURPOSE: To provide a structure having a fine wiring fan out pattern on a chip carrier having thermal expansion coefficient matching that of a circuit board and a method for manufacturing it. CONSTITUTION: This chip comprises a surface array of input/output pads 22 for forming a foot print. A carrier 24 is formed of an organic dielectric, a first set of bonding pads 30 are formed on its one surface, and arranged to correspond to the foot print. The pads 22 are connected to the first set of the pads 30 by solder balls 36 of a first set. A second set of bonding pads 32 are formed on another surface of the carrier 24. A conductive via 34 is extended through the carrier 24 and connected to the pads 30, 32. A circuit board 38 formed of organic material, having a thermal expansion coefficient similar to that of the carrier 24 and having electric connecting sites 42, is provided. The sites 42 are arranged in a pattern corresponding to the pattern of the pad 32 of the second set. A solder ball connection 44 is connected to the sites 42 of the pads 32 of the second set.