| 摘要 |
PURPOSE:To fabricate a large molded package of a hybrid integrated circuit at high yield whose functions can easily be checked. CONSTITUTION:A desired pattern of a hybrid integrated circuit is divided into subpatterns. Each subpattern is thick or thin film on a ceramic substrate 12. Components 18, such as semiconductor chips, capacitors and resistors, are mounted on each ceramic substrate 12. The ceramic substrates 12 are mounted on a single lead frame 14. The individual substrates 12 are connected to each other by wires and each substrate 12 and leads 17 of the lead frame 14 are connected by wires. The substrates 12 and the lead frame 14 are molded with a resin 21. |
