| 摘要 |
PURPOSE:To provide a positive resist material for high energy beam exposure having high sensitivity and resolution and excellent in process adaptivity. CONSTITUTION:In the high energy beam sensitive positive resist containing a resin (A) made by substituting t-butoxycarbonyloxy group for one part of hydroxide group of polyhydroxy styrene, a dissolution inhibitor (B) and an acid generating agent and capable of developing by an alkali aq. solution, (B) contains above one of t-butoxycarbonyloxy group in one molecule, (C) is made by mixing above two kind of the acid generating agent expressed by a formula (chem.1), (R)nAM (in the formula, R is the same or different and is aromatic group or substituted aromatic group, A is sulfonium or iodonium. M is tosylate group or triflate group and (n) is 2 or 3), and the weight ratio is 0.07<=B<=0.40, 0.005<=C<=0.15, 0.55<=A and A+B+C=1. |
