| 摘要 |
PURPOSE:To obtain a power semiconductor device of high reliability wherein assembling manhour is little and manufacturing cost is low. CONSTITUTION:In the title power semiconductor device, a power circuit 1 and a control circuit 2 built in a resin case 4 are mounted on different substrates 1a, 2a, and the circuits are mutually internally connected. A power terminal 6 and a control terminal 7 which are connected with the respective circuits are led out to the outside from the case. The power terminal 6 and the control terminal 7 are arranged on the periphery of the case 4. Lead pins 13 for mutually connecting the power circuit and the control circuit are arranged on a pin block 12 formed at a middle stage position in the case, and previously insert-formed together with the case. The substrate 1a of the power circuit is mounted on a metal base 11 for heat dissipation which is combined with the bottom surface side of the case. The circuit board 2a of the control circuit is mounted on the pin block 12. The power terminal 6 and the control terminal 7 are soldered to the pin block 12, thereby assembling a device. |
