| 摘要 |
PURPOSE:To provide a connecting structure and a method for forming the structure in which a sufficient connecting adhesive strength can be obtained even if adhering positions of gold balls are irregular when an opening is connected to a connecting conductor via a connecting solder (gold ball, etc.). CONSTITUTION:A connecting structure has a constitution in which a connecting conductor 2 is formed on a substrate 1, a coating film 3 having an opening 31 is formed on the conductor 2, an upper layer film 4 having an opening 41 is further formed on the coating film, a connecting solder is stuck to the surface of the conductor to be exposed in the openings 31, 41 and connected via them. The opening 14 of the film 4 is formed larger than the opening 31 of the film 3 by a deviation for holding its adhesive strength even due to an irregularity in the adhering position of the solder. The opening 31 of the film 3 and the opening 41 of the film 4 are formed with separate masks, and the opening 41 of the film 4 is formed larger than that 31 of the film 3. |
