| 摘要 |
PURPOSE:To lessen the inner conductor layer of a multilayer electronic part in thickness by a method wherein metal palladium powder covered with oxide layer other than palladium oxide layer and vehicle composed of solvent and organic resin dissolved into solvent are kneaded and dispersed. CONSTITUTION:Metal palladium powder covered with oxide layer other than palladium oxide layer, vehicle composed of solvent and organic resin dissolved into solvent, and dispersant are kneaded and dispersed into palladium paste. An inner electrode is formed of the palladium paste concerned. By this setup, the inner conductor of a multilayer electronic part can be lessened in thickness, palladium can be lessened in required amount, and a laminated chip capacitor of this design can be set free from defects produced in a heat treatment even if it is of highly multilayered structure. |
