| 摘要 |
<p>PURPOSE: To improve the conformity of a plurality of thin layers, and form via connection of high positioning precision by embedding at least a conductive element in a polymer material which is comparatively non-conductive, and generating a reflow of at least a part of the polymer material around the conductive element. CONSTITUTION: A thermoplastic thin-film equipment for forming via connection has a thermoplastic substrate 100, a holding plate 12, a retaining plate or a die 14, a conductive ball 16 and a drive member 18. The conductive ball 16 is simply separated from the top surface of the holding plate 12 and can be mounted on the holding plate 12, by directly violently swinging the ball 16 from the movement of the holding plate 12, e.g. vibration, or by using a wiper or a squeegee, or with gas or gluid pressure. Thereby the positioning of the ball is enabled with practically the same precision as the precision of the holding plate 12, and moreover this positioning precision can be repeated.</p> |
