| 摘要 |
PURPOSE:To prevent generation of a defective mounting, such as the positional deviation of various electronic components and errected electronic components, and a soldering defect in a soldering mounting of the various electronic components to a printed-wiring board. CONSTITUTION:In a component mounting system constituted of a creamy solder printer 2, a bonding agent coater 3, a component mounter 4, a soldering device 5, a visual inspecting device 6 and the like, the various setting conditions of devices, which are positioned in processes prior to the process using the device 6, are automatically corrected on the basis of feedback data from the device 6. Thereby, the state of soldering and the like are maintained and controlled in the optimum state, a printed-wiring board mounted with various electronic components can correspond rapidly to a change-over of the type of the board and at the same time, the improvement of the yield of soldering and productivity and the stabilization of the quantity of the board can be achieved. |
