| 摘要 |
A machine (100) that performs the steps of cleaning, rinsing and drying required prior to further processing in the course of conventional semiconductor fabrication in a single, hermetically and thermally insulated, process chamber (44). The machine consists of functionally compartmentalized sections connected to the process chamber for each specific function, comprising a cleaning-solution storage (72) and circulation section, a rinsing fluid storage (50) and circulation section, and a vacuum drying section (130). After enclosing the semiconductor product hermetically in the process chamber, a cleaning solution from an internal holding source is heated and circulated through it for the cleansing step, followed by purified water to rinse the cleaning fluid off the surface of the semiconductor material. A vacuum is then applied to completely remove any residue of rinsing water left on the wafers. |
