发明名称 |
CIRCUIT INTERCONNECT SYSTEM |
摘要 |
A circuit interconnect system comprises a circuit pattern (22) on a rigid insulating sheet (17), forming a first circuit carrying substrate (12). A portion of the circuit pattern wraps around an edge of the insulating sheet and continues onto a vertical wall (20) of the sheet to provide a contact surface (24). An electrically conductive portion (16) of a second member (14) is mated to the first circuit carrying substrate by aligning the contact surface to the electrically conductive portion. An electrically conductive resilient material such as a conductive elastomer (35) or metal spring (35) provides electrical interconnection between the circuit pattern and the electrically conductive portion. |
申请公布号 |
WO9403942(A1) |
申请公布日期 |
1994.02.17 |
申请号 |
WO1993US06185 |
申请日期 |
1993.06.29 |
申请人 |
MOTOROLA, INC. |
发明人 |
DESANTIS, JOHN, A.;ALBERTSON, PETER, E. |
分类号 |
H01R12/52;H01R12/82;H01R13/24;H05K3/32;H05K3/36;(IPC1-7):H01R9/09 |
主分类号 |
H01R12/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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