| 摘要 |
<p>A thermosetting resin composition comprising (a) an aromatic polyamide oligomer having polymerizable unsaturated groups on both terminals or the side chains, (b) a maleimide compound, and (c) an epoxy resin; and a process for producing a copper-clad laminated board by impregnating a base material with the composition and bonding the resultant base material to copper foil under pressure. The copper foil can be tightly bonded to give a copper-clad laminated board excellent in heat resistance and electrical characteristics.</p> |
