发明名称 IMPROVED SPREADER FOR APPLYING BONDING COMPOUNDS
摘要 <p>An improved tool for spreading bonding compound, or the like, on planar surfaces which, in a first embodiment, includes a contoured surface (15, 16) having two end tip portions (40) and a midportion (20) contained in a plane spaced between the end tip portions. The tool includes a back (64) which gives structural integrity to the tool, and a flexible outer edge connected to the application face (15). In use, the bonding compound is applied to the planar surface, and the projecting flexible outer edge of the application face is forced against the wall and pulled along to obtain a flat surface to spread the bonding compound evenly and smoothly over the planar surface. The flexible outer edge can be removable and replaceable for adjusting to varying surfaces and for easy maintenance.</p>
申请公布号 WO1994003095(A1) 申请公布日期 1994.02.17
申请号 US1993007139 申请日期 1993.07.28
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