CARRYING TRAY

摘要

PURPOSE:To prevent bending of the leads of semiconductor integrated circuit device of face mounting package structure during the carriage by a carrying tray. CONSTITUTION:In carrying QFP 6 by a carrying tray 1a having a hole 4 formed through the center of its package mounting part 3 and a pressure-sensitive adhesive tape 5 attached to the rear face of the carrying tray 1a, the adhesive face of the tape 5 exposed through the hole 4 is attached to the underside of a package body 6a of QFP 6 to temporarily secure QFP 6 in place.