发明名称 PLAIN POLISHING DEVICE
摘要 PURPOSE:To facilitate pad changing work and perform it in a short time, by retractively providing work positioning stoppers, on which plural work abutting points are formed in a direction to interrupt the rotational direction of a surface plate, on the periphery of the surface plate toward the inner side from the outer peripheral side of the surface plate, in a plain polishing device such as a semiconductor wafer. CONSTITUTION:Stoppers 30a-30d (hereafter referred to as stopper 30) are rotatably fitted at a given angle to the periphery of a surface plate 21 with four rotational shafts 29 provided at regular intervals in a peripheral direction. The stoppers 30 are formed into a thin plate-form curved in an arc shape in a plan view, and are made so that curved recessed parts 31 can be directed to the surface plate 21 side in nonoperatable positions shown by broken lines and can be positioned so as to cross the outer peripheral of the surface plate 21 in operation positions shown by continuous lines. Positioning rollers 32 and 32 are provided on a tip part and a base end part respectively in the stoppers 30 so as to be slightly protruded to the inner side of the recessed parts 31. Setting the stoppers 30 to the operation positions performs positioning with the positioning rollers 32 and 32 abutting on work W1-W4.
申请公布号 JPH0639706(A) 申请公布日期 1994.02.15
申请号 JP19920006910 申请日期 1992.01.17
申请人 MITSUBISHI MATERIALS CORP;MITSUBISHI MATERIALS SHILICON CORP 发明人 TSUTSUMI YUKIO;MATSUMOTO TATSUMI;TAKAHASHI KEISUKE
分类号 B24B37/00;B24B37/10;B24B37/30 主分类号 B24B37/00
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