发明名称 |
MOLD APPARATUS FOR RESIN MOLDING |
摘要 |
PURPOSE:To provide a resin molding mold apparatus wherein a mold can be smoothly and quickly heated and cooled and a molded item can be easily taken out and stored and productivity can be improved. CONSTITUTION:When molding is performed, a heated oil storing part 8 is connected with a circulation path 5 by using a three-way valve 7 and the heated oil is fed to each of mold plates 1 and 3 to heat each of chases 2 and 4 and when a molded item is taken out, a cooled oil storing part 9 is connected with the circulation path 5 and the cooled oil is fed to each of the mold plates 1 and 3 to cool the molded item in both chases 2 and 4. |
申请公布号 |
JPH0639888(A) |
申请公布日期 |
1994.02.15 |
申请号 |
JP19920006014 |
申请日期 |
1992.01.16 |
申请人 |
MITSUBISHI MATERIALS CORP |
发明人 |
NAKAMURA TERUHIRO |
分类号 |
B29C33/04;B29C45/02;B29C45/26;B29C45/73;B29K101/10;B29L31/34;(IPC1-7):B29C45/73 |
主分类号 |
B29C33/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|