发明名称 MOLD APPARATUS FOR RESIN MOLDING
摘要 PURPOSE:To provide a resin molding mold apparatus wherein a mold can be smoothly and quickly heated and cooled and a molded item can be easily taken out and stored and productivity can be improved. CONSTITUTION:When molding is performed, a heated oil storing part 8 is connected with a circulation path 5 by using a three-way valve 7 and the heated oil is fed to each of mold plates 1 and 3 to heat each of chases 2 and 4 and when a molded item is taken out, a cooled oil storing part 9 is connected with the circulation path 5 and the cooled oil is fed to each of the mold plates 1 and 3 to cool the molded item in both chases 2 and 4.
申请公布号 JPH0639888(A) 申请公布日期 1994.02.15
申请号 JP19920006014 申请日期 1992.01.16
申请人 MITSUBISHI MATERIALS CORP 发明人 NAKAMURA TERUHIRO
分类号 B29C33/04;B29C45/02;B29C45/26;B29C45/73;B29K101/10;B29L31/34;(IPC1-7):B29C45/73 主分类号 B29C33/04
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