Packaging for semiconductors

摘要

Semiconductor chips are packaged by injection molding while continuously feeding a lead frame, characterized by using for the injection molding a hydrogenated polymer (A) obtained by the hydrogenation of a polymer obtained by ring-opening polymerization of a specific norbornene derivative or a monomer mixture comprising said norbornene derivative and other monomer copolymerizable therewith, wherein said injection molding for the packaging is carried out under the conditions of a resin temperature in the range of 280 degrees C. to 360 degrees C.; the molding temperature in the range of Tg -80 degrees C. to Tg +10 degrees C., wherein Tg is the glass transition temperature of the hydrogenated polymer (A) is Tg; and the injection pressure in the range of 10 to 200 kgf/cm2.