| 摘要 |
Proposed is a process for the manufacture of mechanical microstructures for sensors or actuators in semiconductor wafers. Areas of local oxidation are produced by masking techniques in the surfaces of at least two wafers (10, 22) in such a way that plane wafer surfaces result. The at least two wafers are subsequently joined to each other in such a way that the areas of local oxidation on the at least two wafers are in direct contact. The actual sensor structure (35, 36), which will undergo mechanical deformation under certain conditions, is exposed by dissolving away the local oxidation. |
