| 摘要 |
In a tape feeding apparatus used in bonding machines for semiconductor devices, both upper and lower tape clampers are driven upward and downward. Thus, during the tape feeding operation, the upper clamper and the lower clamper can be both withdrawn from a tape feeding path so that neither the upper surface nor the under surface of the tape contact the upper clamper nor the lower clamper. No scratches, etc. would occur in the tape. In addition, the bonding level of the tape is determined by the upper surface of the lower clamper during the tape clamping operation, thus securing high bonding precision.
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