SEMICONDUCTOR PACKAGE

摘要

The semiconductor package has an insulator formed by a supporting portion, a mounting portion and connecting members, and a layer of electrically conductive material on the insulator in a pattern forming a pad. Inner leads are connected to the pad by supporting bars. A chip is attached on the pad, and the inner leads are wire-connected to the chip. The pad is vertically offset from the inner leads and the chip is supported in recessed fashion on the pad which shortness the length of the connecting wires. Wire-connecting efficiency and structual stability are improved.