| 摘要 |
A projection exposure apparatus for use in an LSI manufacturing process includes a light source for emitting incoherent light, a polyhedral prism for splitting the incoherent light from the light source into a plurality of rays of light, a condensing system for condensing the plurality of rays of light into overlapping rays illuminating a mask having a circuit pattern, and a projection lens system for condensing the light transmitted through the mask on the surface of a wafer.
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