发明名称 COOLING STRUCTURE FOR MAIN SPINDLE DEVICE
摘要 <p>PURPOSE:To provide the coolant structure of a main spindle device which can be cooled uniformly and efficiently without increasing the quantity of parts and without being restrained in design. CONSTITUTION:A cooling structure for a main spindle device which is equipped with a spindle head (housing) 1 and a main spindle 3 which is axially supported on the spindle head through a roller bearing outer cylinder 9 is constituted. In this case, a spiral groove 16 is formed on the outer surface of the spindle 3, and the space formed from the spiral groove 16 and the inner surface of a bearing inner cylinder 11 is used as coolant flow passage.</p>
申请公布号 JPH0631585(A) 申请公布日期 1994.02.08
申请号 JP19920194005 申请日期 1992.07.21
申请人 MORI SEIKI CO LTD 发明人 WATANABE MICHIO
分类号 B23Q11/12;(IPC1-7):B23Q11/12 主分类号 B23Q11/12
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