发明名称 |
Method and apparatus for forming metal leads |
摘要 |
The excise and lead form of TAB leads bonded to an integrated circuit chip. Leads extending beyond a sidewall are clamped between a first clamp and a form anvil at a first portion spaced from the chip. The leads are also clamped between an excise/form tool and a second clamp at a second portion spaced further from the chip than the first portion. An excise blade cuts the leads outside the second portion. Then the excise/form tool, second clamp and excise blade move downwards in a curved path toward the chip to form a first lead corner against the form anvil and a second lead corner against the excise/form tool without splaying or galling the leads.
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申请公布号 |
US5283946(A) |
申请公布日期 |
1994.02.08 |
申请号 |
US19930062876 |
申请日期 |
1993.05.17 |
申请人 |
MICROELECTRONICS AND COMPUTER TECHNOLOGY CORPORATION |
发明人 |
SIMMONS, RICHARD L.;WEHRLY, JR., JAMES D.;BERTRAM, MICHAEL J. |
分类号 |
H01L21/00;H01L23/495;(IPC1-7):H01R43/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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