| 摘要 |
Laser diode array fabrication is facilitated by provision of a monolithic substrate with one or more grooves of the same approximate depth and width as laser diodes secured therein. A metallization layer is provided in the grooves, and the laser diodes secured in the grooves thereafter. Depending on the size of the original substrate being used for the laser array mount, one or more submounts may be formed by cutting the substrate. Additionally, insertion of the laser diodes into the grooves may be facilitated by flexure of the substrate from the bottom, thus separating the groove walls at the top. |
