| 摘要 |
Methods of producing a printed circuit board having a desired conductive pattern thereon provide the upper surface of a substrate board with raised portions having trenches therebetween. The raised portions, which define a desired conductive pattern, are then treated to form conductors thereon. In a first method, the resin used in the laminant forming the substrate board includes a hard particulate filler such as glass beads that are exposed at the raised portions of the substrate surface following grinding. Conductive metal is then welded onto the exposed filler to form a desired conductive layer over the raised portions. In a second method, the resin of the laminant forming the substrate board includes conductive metallic powder, such that burnishing of the raised portions forms conductors at the raised portions. In a third method, a conductive layer is laminated to the upper surface of the substrate board using adhesive and hot pressing, following which the unbonded portions of the conductive layer at the trenches are removed, such as by shot peening. The remaining portions of the conductive layer form the desired conductive pattern.
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