发明名称 Flame-resistant photo-curable resin composition
摘要 A flame-resistant, photo-curing resin composition of the present invention consists of: (a) 35 to 65 parts by weight of an acrylic thermoplastic polymer, the acrylic thermoplastic polymer being 15 to 30% by weight copolymerized with at least one of monomer containing an alpha, beta-unsaturated carboxyl group, (b) 5 to 30 parts by weight of a bromine-substituted monomer represented by a general formula (I): (* CHEMICAL STRUCTURE *) (I) wherein R1 is H or CH3, A is (* CHEMICAL STRUCTURE *) wherein R2 is an alkylene group containing two or three carbon atoms, n is an integer between 1 and 4, and X1, X2, and X3 are Br or H, under a condition that at least two of the X1, X2, and X3 are Br, (c) 0 to 10 parts by weight of antimony trioxide particles with an average diameter of 0.1 (my)m or smaller, (d) 20 to 50 parts by weight of a vinyl monomer, excluding component (b), and (e) 0.01 to 10 parts by weight of a photo-polymerizing initiator, wherein a total amount of the component (a), (b), (c), (d), and (e) is 100 parts by weight.
申请公布号 US5284736(A) 申请公布日期 1994.02.08
申请号 US19910801386 申请日期 1991.12.02
申请人 MITSUBISHI RAYON CO., LTD. 发明人 KUSHI, KENJI;INUKAI, KEN-ICHI
分类号 C08F2/50;G03F7/004;G03F7/027;G03F7/029;G03F7/031;G03F7/033;H01L21/027;H05K3/28;(IPC1-7):C08F2/50;C08F265/06 主分类号 C08F2/50
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