| 摘要 |
PURPOSE:To provide a semiconductor device in which a semiconductor element can be operated normally and stably for a long time by rigidly adhesively fixing the element to a vessel made of an insulating base and a cover. CONSTITUTION:A semiconductor device has an insulating base 1 having a placing part 1a to be placed with a semiconductor element 3 and a cover 2 in such a manner that the element 3 is adhered at its lower surface to the base 1 with glass adhesive 4 to be fixed therein. The adhesive 4 has therein a first region having a thermal expansion coefficient of 5.5-6.0X10<-6>/ deg.C at the side of the base 1 and a second region having a thermal expansion coefficient of 3.8-5.0X10<-6>/ deg.C at the side of the element 3. |
