发明名称 Arrangemang för reglering av elektroniska komponenters temperatur
摘要 <p>The invention relates to an arrangement for controlling the temperature of electronic components, the arrangement comprising a detecting means (TE) for measuring the temperature of an electronic component and for producing a control signal (M1) varying with the temperature; a Peltier element (P) connected heat-conductively to the electronic component for controlling the temperature of the electronic component in accordance with the strength of the current flowing through the Peltier element (P); a power supply (PS) for supplying current to the Peltier element (P); a control means (BC) for controlling the direction of the current flowing through the Peltier element (P) in response to the control signal (M1) produced by the detecting means (TE); and a second control means (SU) for controlling the strength of the current flowing through the Peltier element (P) in response to the control signal (M1) produced by the detecting means (TE). In the arrangement the power supply (PS) supplying the Peltier element (P) is the power supply of the electronic component with a controllable temperature, and the power supply (PS) is connected in series with the Peltier element (P).</p>
申请公布号 FI923493(A) 申请公布日期 1994.02.04
申请号 FI19920003493 申请日期 1992.08.03
申请人 NOKIA TELECOMMUNICATIONS OY 发明人 O'SHEA, DENIS;SIROLA, EERO;RISTIMAEKI, HEMMO
分类号 G05D23/24;H01S5/024;(IPC1-7):H05K7/20;H01S3/043;H01L23/38 主分类号 G05D23/24
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