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发明名称
STRUCTURE FOR CONNECTING WIRING LAYERS OF A SEMICONDUCTOR DEVICE
摘要
申请公布号
JPH0629403(A)
申请公布日期
1994.02.04
申请号
JP19920184955
申请日期
1992.07.13
申请人
MITSUBISHI ELECTRIC CORP
发明人
HARADA SHIGERU
分类号
H01L21/28;H01L21/3205;H01L21/768;H01L23/52;H01L23/522;(IPC1-7):H01L21/90;H01L21/320
主分类号
H01L21/28
代理机构
代理人
主权项
地址
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