发明名称 MULTILAYERED WIRING COMPOSITION AND PATTERN WORKING METHOD OF POLYIMIDE BASED INSULATING FILM
摘要 PURPOSE:To prevent deterioration of adhesion between a polyimide film and a substrate, exfoliation from the substrate, and cracks due to exfoliation, by restraining stress from concentrating on the end portion of periphery of the polyimide based insulating film. CONSTITUTION:After a metal wiring layer as a first layer is laminated on a substrate 2 by sputtering or the like, a metal wiring 3 is formed by phtolithography technique or the like. A polyimide based insulating film 5 is formed and a metal wiring 4 as a second layer is formed by an opening process. In the pattern working of the film 5, photosensitive polyimide precursor is used as the resin constituting the film 5, and pattern working is performed by using a mask provided with a part where optical concentration continuously changes so as to correspond with a specified position of peripheral, side of the polyimide based insulating film. Hence the peripheral part 7 of the polyimide based insulating film is formed in a slant type. The slant angle 6 is desirable to be 10-80 deg.. Thereby stress can be restrained from concentrating on the end portion of periphery of the polyimide based insulating film.
申请公布号 JPH0629662(A) 申请公布日期 1994.02.04
申请号 JP19920184124 申请日期 1992.07.10
申请人 TORAY IND INC 发明人 NIWA KATSUHIRO;EGUCHI MASUICHI;ASANO MASAYA
分类号 H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/46
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