| 摘要 |
PURPOSE:To suppress failures such as voids, non-fillings and wire sweeps by eliminating, as much as possible, a time difference between when resin initially flows into a semiconductor element and when the last semiconductor element in a die is filled with resin. CONSTITUTION:A plastic-sealing die for the manufacture of a semiconductor device is provided with, at least, a semiconductor element mount, a semiconductor element, inner leads, wires or leads for connecting the element to the inner leads, resin for sealing them, and outer leads. Over the entire leadframe, the length of a runner 2 from a pot 1 to the semiconductor element mount is the same within a range of + or -5cm, or the runner 2 is divided into branches around the intermediate position thereof only once. This makes it possible to set requirements with a considerable margin in molding processes. |
