发明名称 SEMICONDUCTOR SUBSTRATE UNLOADING METHOD, EXPOSURE APPARATUS AND MANUFACTURE OF SEMICONDUCTOR
摘要 PURPOSE:To obtain an unloading method which can confirm exposure of a wafer without development at the time of processing the wafer with the exposure apparatus. CONSTITUTION:A wafer 17 having completed the exposure processing on an exposure stage 16 is moved up to a rotatable stage 18 with a transfer arm 19. If the exposure process includes a defect, the wafer 14 is rotated on the rotatable stage 18 to change the position of the wafer having completed the normal exposure and the orientation flag. Therefore, it can be confirmed without development whether the wafer has completed the exposure process and it is no longer necessary for exposure processing to conduct separation of resist and coating of resist for the reexposure process. As a result, productivity can be improved remarkably through reduction of load on the workers and improvement of throughput of semiconductor device manufacture.
申请公布号 JPH0629171(A) 申请公布日期 1994.02.04
申请号 JP19920179990 申请日期 1992.07.07
申请人 SEIKO EPSON CORP 发明人 OGOSHI TAKESHI
分类号 H01L21/30;G03F7/20;H01L21/027;H01L21/677;(IPC1-7):H01L21/027;H01L21/68 主分类号 H01L21/30
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