| 摘要 |
PURPOSE:To conduct input and output of an external signal and supply of a power source in a non-contact state without executing a mechanical connection system in order to largely delete the number of assembling steps and a wire cost. CONSTITUTION:A semiconductor package base 20, a semiconductor chip 21 to be placed in the base 20, first light emitting.receiving elements 23, 22 as pad electrodes formed on a surface of the chip 21, and second light emitting.receiving elements 31, 32 as external lead electrodes to be so formed as to correspond to the elements 23, 22 in a package cover 30 are provided, and the elements 23, 22 and 31, 32 are disposed at an infinitesimal interval therebetween. Further, light transmission resin 34 for sealing between the elements 23, 22 and 31, 32 is provided. |
