| 摘要 |
<p>PURPOSE:To obtain a via forming method in a ceramic multilayered substrate capable of improving packaging reliability of mounting parts, by eliminating the protruding part of a via of a ceramic dielectrics layer. CONSTITUTION:In the via forming method in a ceramic multilayered substrate wherein conductor formed on each ceramic dielectrics layer of a ceramic multilayered substrate is electrically connected for each layer, penetrating holes 22 are formed in a ceramic dielectric layer 21, blotting chemical paper 24 is stuck on the rear of the ceramic dielectric layer 21, the penetrating holes 22 are subjected to via printing, blotting chemical paper 26 is stuck on the surface of the ceramic dielectric layer 21, drying is performed, the paper 24 on the rear and the paper 26 on the surface are peeled, and the protruding parts of vias 27 are eliminated.</p> |
