An overcurrent preventive diode (1) comprises a diode chip (2) sandwiched between respective bonding ends of first and second leads (3, 4). The bonding end of the first lead is directly bonded to the diode chip into electrical conduction while being also kept in heat conduction with the chip. The bonding end of the second lead is held in heat conduction with the diode chip via a thin electrical insulating layer (5). The bonding end of the second lead and the insulating layer are shaped to expose an electrical connecting portion of the chip, thereby enabling the second lead bonding end to be electrically connected to the chip through a fusing wire (7) which is designed to be melt-cut upon passage of a predetermined overcurrent.
