Chip-Modul,申请号DE19924225154-传众专利搜索

发明名称	Chip-Modul
摘要	The aim of the invention is to design a chip module which largely avoids edge shorting of the chip (2). The invention achieves this aim by virtue of the fact that bond islands are disposed on the chip away from the edge, the bond islands being connected by bond leads (4) to conductor tracks (5) on the circuit board (1). The invention concerns a chip module comprising at least one chip, preferably a store or processor, located on a circuit board.
申请公布号	DE4225154(A1)	申请公布日期	1994.02.03
申请号	DE19924225154	申请日期	1992.07.30
申请人	MEYERHOFF, DIETER, 4010 HILDEN, DE	发明人	KNOBLAUCH, WOLFGANG, O-5912 SEEBACH, DE;JAHN, GISELA, O-5912 SEEBACH, DE;SANDER, ROLAND, O-5901 KITTELSTAHL, DE;KLEMM, RONALD, O-5900 EISENACH, DE;ALBIN, DIETER, O-5912 SEEBACH, DE;PAHL, SIEGFRIED, O-5912 SEEBACH, DE;BAAKE, DIETER, O-5912 SEEBACH, DE;PERSCHKE, STEPHAN, 4330 MUELHEIM, DE
分类号	H01L25/18;H01L21/60;H01L23/13;H01L25/04;H01L25/065	主分类号	H01L25/18
代理机构		代理人
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