发明名称 |
Electrically insulated heat pipe type cooling apparatus for semiconductor |
摘要 |
An electrically insulated heat pipe type cooling apparatus for a semiconductor comprising a heat absorption section for cooling a semiconductor, a heat dissipation section and an intermediate electrical insulation section. This apparatus is capable of highly improving cooling efficiency for a semiconductor and exhibiting satisfactory electrical insulation.
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申请公布号 |
US5283464(A) |
申请公布日期 |
1994.02.01 |
申请号 |
US19930064348 |
申请日期 |
1993.05.20 |
申请人 |
THE FURUKAWA ELECTRIC CO., LTD. |
发明人 |
MURASE, TAKASHI |
分类号 |
H01L23/427;H01L23/473;(IPC1-7):H01L23/02;H01L25/04 |
主分类号 |
H01L23/427 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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