发明名称 |
Trench sidewall structure |
摘要 |
The invention provides a trench sidewall structure and a method of forming and using the same to reduce parasitic sidewall leakage through a trench sidewall, for example from bitline contact to storage node or from storage node to substrate. The method involves placing a polysilicon layer of the same polarity as that of the array well, along with a diffusion barrier layer such an titanium nitride, between the storage node poly and the oxide collar.
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申请公布号 |
US5283453(A) |
申请公布日期 |
1994.02.01 |
申请号 |
US19920956125 |
申请日期 |
1992.10.02 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
RAJEEVAKUMAR, THEKKEMADATHIL |
分类号 |
H01L21/76;H01L21/822;H01L21/8242;H01L27/04;H01L27/10;H01L27/108;H01L29/94;(IPC1-7):H01L29/68 |
主分类号 |
H01L21/76 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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