SHEET-FORM RESILIENT FOAM AND JIG FOR POLISHING WAFER BY USING IT

摘要

PURPOSE:To provide a sheet-form resilient foam which is used as a packing pad for a waxless polishing by means of which a mirror polishing wafer having excellent flatness. CONSTITUTION:A sheet-form resilient foam has at least under-mentioned foam layer 2. A plurality of air bubbles 4 of the foam layer 2 is (1) independent air bubbles dispersed in parallel approximately at equal intervals in the direction of the area of the foam layer 2 and the sizes, the shapes, and the formation positions of the air bubbles 4 are approximately equal in the direction of the thickness of the foam layer 2; (2) the central line in the direction of length of the air bubbles 4 is extended along the direction of the thickness of the foam 2; and (3) the diameter of the air bubble 4 is minimum at the end part on one surface side of the foam layer 2 and gradually increased from one surface side to the other surface side of the foam layer 2, and opening parts 6 are formed in the surface of the foam layer 2.