发明名称 HEAT-SHRINKABLE MOLDED OBJECT
摘要 <p>PURPOSE:To provide a heat-shrinkable molded object capable of being uniformly thermally shrunk by resistance heating and capable of enhancing the accuracy of the measuring result at the time of flaw detection monitoring. CONSTITUTION:A heat-shrinkable molded object is constituted by combining a heat-shrinkable resin molded object 1 and a heatshrinkable resin molded object 3 having a felexible resistance heater 3a subjected to insulating coating through a release layer 2.</p>
申请公布号 JPH0623898(A) 申请公布日期 1994.02.01
申请号 JP19920180682 申请日期 1992.07.08
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 MORITA TORU;MONMA TETSUO
分类号 B29C63/18;B29C63/38;B32B1/08;B32B7/06;B32B37/00;H05B3/18;(IPC1-7):B32B7/06;B32B31/18 主分类号 B29C63/18
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