发明名称 |
HEAT-SHRINKABLE MOLDED OBJECT |
摘要 |
<p>PURPOSE:To provide a heat-shrinkable molded object capable of being uniformly thermally shrunk by resistance heating and capable of enhancing the accuracy of the measuring result at the time of flaw detection monitoring. CONSTITUTION:A heat-shrinkable molded object is constituted by combining a heat-shrinkable resin molded object 1 and a heatshrinkable resin molded object 3 having a felexible resistance heater 3a subjected to insulating coating through a release layer 2.</p> |
申请公布号 |
JPH0623898(A) |
申请公布日期 |
1994.02.01 |
申请号 |
JP19920180682 |
申请日期 |
1992.07.08 |
申请人 |
FURUKAWA ELECTRIC CO LTD:THE |
发明人 |
MORITA TORU;MONMA TETSUO |
分类号 |
B29C63/18;B29C63/38;B32B1/08;B32B7/06;B32B37/00;H05B3/18;(IPC1-7):B32B7/06;B32B31/18 |
主分类号 |
B29C63/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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