发明名称 |
Integrated heat pipe and circuit board structure |
摘要 |
A heat pipe structure is incorporated directly into the metal baseplate of a circuit card thereby eliminating thermal contact resistance between the baseplate and the heat pipe assembly. Components are mounted on a copper circuit layer bonded to a dielectric layer in a first portion of the baseplate with a second portion of the baseplate/heat pipe assembly extending into a heat sink/cold plate condensing area for removal of heat generated in the component portion.
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申请公布号 |
US5283715(A) |
申请公布日期 |
1994.02.01 |
申请号 |
US19920953080 |
申请日期 |
1992.09.29 |
申请人 |
INTERNATIONAL BUSINESS MACHINES, INC. |
发明人 |
CARLSTEN, RONALD W.;KIM, SUNG J.;MURPHY, ALAN L. |
分类号 |
H05K1/02;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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