| 摘要 |
The present invention relates to a substrate (10) integrated with a cooler, for power electronics elements. The substrate comprises an electrically insulating, heat conducting plate (12), each side of which is joined to a layer (14, 16) of electrically conducting and heat conducting material. One conducting layer (14) has a circuit pattern and acts as the support for at least one power electronics element, such as a power semiconductor. According to the invention the other conducting layer (16) is made with a many times greater area than the electrically insulating plate (12), and the portion (18-32) of said other layer (16) extending outside the plate is folded into a heat sink. |
