High density memory and method of forming the same

摘要

A high density memory module (10) includes a plurality of subassemblies (12), each subassembly (12) including a memory circuit (20), a lead frame (26) having a plurality of leads (14) coupled to the memory circuit (20) and encapsulating material (13) surrounding the memory circuit (20) and lead frame (26) such that the leads (14) extend outwardly from the encapsulating material (13). The memory module (10) is easily assembled and provides high density storage capability with convective heat transfer to reduce the temperature within the stack of subassemblies (12). A single lead frame (26) may be selectively addressed for use with each subassembly (12) within the memory module (10).