| 摘要 |
An in-floor multiple-service wiring device and, more particularly, a poke-through wiring fitting incorporating a novel flap cover assembly, and which fitting is adapted to be positioned in a floor aperture of a concrete building floor for the conductance of electrical power and telecommunication signals between the work spaces of multi-storied buildings. The flap cover assembly incorporates an upper cover plate consisting of metallic material, preferably such as brass or the like, and a lower cover plate, preferably constituted from a rigid molded plastic material and which is fastened to the upper plate member in surface contact with the rear face thereof. Hereby, aligned apertures axe formed in both the upper and lower cover plate members, and with metallic flap covers being hingedly connected to the cover plate assembly so as to essentially be able to close off the apertures formed therein which are superimposed on the somewhat smaller- dimensioned aligned apertures formed in the lower plastic plate member, and whereby cooperative connecting structure for resiliently biasing the flap covers into normally closed positions are operatively interposed between the upper and lower cover plate members during assembly of the plate members.
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