| 摘要 |
PURPOSE:To easily from an intermediate insulation layer having nearly flat surface obtained by using heat-resistant imido resin that cures and contracts without effects of conductors such as vias. CONSTITUTION:An insulation board 1 on which a conductor pattern 2, a via 4, etc., are formed as a base material is applied with the mixture of a heat- resistant granular imido resin 7a which forms intermediate insulation layer and a heat-resistant, uncured liquid imido resin 7b, and than the surface of the imido resin 7 is nearly flatted by turning around the applied insulation board 1, and further, the imido resin 7 is cured, before an upper layer conductor is formed on the nearly flat cured surface. |
