| 摘要 |
<p>PURPOSE:To provide a semiconductor device of multipin while moreover being hard to cause a shortcircuit at the time of soldering in a surface mounting type semiconductor device. CONSTITUTION:In this surface mounted semiconductor device consisting of a semiconductor chip where a plurality of electrodes are formed on the surface, the internal leads to be connected by the electrodes and fine wires, the resin sealing these and the external leads connecting to the neighboring external leads 2, 3 inside one side are different in the bending shapes and the parts 7, 8 to be soldered are not piled up in a straight line on the sides.</p> |
