| 摘要 |
PURPOSE: To provide a semiconductor device having a packet sealed by an ultraviolet curing and thixotropy acrylic epoxy and a method for sealing the package. CONSTITUTION: A package is sealed at a room temperature by a polymer cross- linking of an epoxy, starting with the exposure of the epoxy to at least one part of ultraviolet rays. An electronic part 14 is attached to the prescribed position of a substrate 12. A cover body 24 having an ultraviolet curing epoxy layer screen-printed on a bonding part is placed on the substrate 12, and the electronic part 14 is sealed in a cavity formed by the connection of the substrate 12 with the cover part 24. The cover part 24 is sealed by the substrate 12, by irradiating the exposed green part of the epoxy layer with radiation having ultraviolet frequencies. The sealing is formed at a room temperature, so that thermal damages on material sensitive to temperature can be prevented. |
