LEAD, IC DEVICE ASSEMBLING METHOD, IC DEVICE, CONDUCTIVE PATH PROVIDING LEAD, AND CONDUCTIVE PATH PROVIDING METHOD

摘要

PURPOSE:To provide a lead with which solder joint having favorable vibration resistance can be obtained. CONSTITUTION:A lead comprises an upper part 3 and a lower part 4. The upper part 3 is provided with a clip structure 2. The lower part 4 has a thin and long forward end part 7 to be inserted into a throughhole electrode 9 of a lower side substrate 10, and it also has a long hole 5 to generate capillary phenomenon of flux for solder 8 in a main body part of the lower part 4 above the forward end part 7. Lead is hard to be broken in a solder joint part to the throughhole electrode 9.